Yong-Sung Choi,: search on Z-Library

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1

Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis

Yoon, Hyungseok, Choi, Kwang-Seong, Bae, Hyun-Cheol, Moon, Jong-Tae, Eom, Yong-Sung, Jeon, Insu

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 3.70 MB

english, 2017

2

Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications

Lee, Haksun, Eom, Yong-Sung, Bae, Hyun-Cheol, Choi, Kwang-Seong, Lee, Jin Ho

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 2.82 MB

english, 2014

3

Self-Powered Autonomous Wireless Sensor Node by Using Silicon-Based 3D Thermoelectric Energy Generator for Environmental Monitoring Application

Im, Jong-Pil, Kim, Jeong Hun, Lee, Jae Woo, Woo, Ji Yong, Im, Sol Yee, Kim, Yeriaron, Eom, Yong-Sung, Choi, Won Chul, Kim, Jun Soo, Moon, Seung Eon

Journal:

Year:

2020

Language:

english

File:

PDF, 10.33 MB

english, 2020

4

GIS mapping of regional probabilistic groundwater potential in the area of Pohang City, Korea

Hyun-Joo Oh, Yong-Sung Kim, Jong-Kuk Choi, Eungyu Park, Saro Lee

Journal:

Journal of Hydrology

Year:

2011

Language:

english

File:

PDF, 2.82 MB

english, 2011

5

Genomic detection using an indicator-free DNA on a DNA chip microarray

Yong-Sung Choi, Kyung-Sup Lee, Dae-Hee Park

Journal:

Current Applied Physics

Year:

2006

Language:

english

File:

PDF, 334 KB

english, 2006

6

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Novel low-volume solder-on-pad (SoP) material and process for flip chip bonding using Au stud bumps

Choi, Kwang-Seong, Bae, Ho-Eun, Jeon, Su-Jeong, Bae, Hyun-Cheol, Eom, Yong-Sung

Year:

2012

Language:

english

File:

PDF, 1.17 MB

english, 2012

7

HV-SoP Technology for Maskless Fine-Pitch Bumping Process

Son, Jihye, Eom, Yong-Sung, Choi, Kwang-Seong, Lee, Haksun, Bae, Hyun-Cheol, Lee, Jin-Ho

Journal:

Year:

2015

Language:

english

File:

PDF, 1.24 MB

english, 2015

8

Crystal Structure of a Minimal Nitroreductase, ydjA, from Escherichia coli K12 with and without FMN Cofactor

Ji-Woo Choi, Jieun Lee, Kosuke Nishi, Yong-Sung Kim, Che-Hun Jung, Jeong-Sun Kim

Journal:

Journal of Molecular Biology

Year:

2008

Language:

english

File:

PDF, 2.99 MB

english, 2008

9

TMS Partners in Progress

Choi, So-Jung, Lee, Hyeseon, Choe, Chungyoul, Shin, Yong-Sung, Lee, Jinseon, Moon, Sung-Hwan, Kim, Jhingook

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

2014

Language:

english

File:

PDF, 679 KB

english, 2014

10

Closed-form analytical expressions for the breakdown voltage of GaAs parallel-plane p+n junction in 〈100〉, 〈110〉 and 〈111〉 orientations

Yong-Sung Chung, Seung-Youp Han, Yearn-Ik Choi, Sang-Koo Chung

Journal:

Solid-State Electronics

Year:

1996

Language:

english

File:

PDF, 177 KB

english, 1996

11

[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Development of low contact resistance interconnection for display applications

Lee, Haksun, Eom, Yong-Sung, Bae, Hyun-Cheol, Choi, Kwang-Seong, Lee, Jin Ho

Year:

2014

Language:

english

File:

PDF, 1.76 MB

english, 2014

12

[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Silica filler content in NCP and its effects on the reliability of 3D TSV Multi-Stack under thermal shock test

Alves Braganca, Wagno, Eom, Yong-Sung, Son, Jihye, Jang, Keon-Soo, Bae, Hyun-Cheol, Moon, Seok Hwan, Choi, Kwang-Seong

Year:

2017

File:

PDF, 2.24 MB

2017

13

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology

Choi, Kwang-Seong, Joo, Jiho, Jang, Ki-seok, Eom, Yong-Sung, Choi, Gwang-Mun, Yun, Ho-Gyeong, Moon, Seok Hwan, Kim, Jong-Sun, Oh, Mingyun, Choi, Ji-Hoon, Choi, Ji-Woong, Cho, Sung-Yun, Choi, Shin, Par

Year:

2020

File:

PDF, 695 KB

2020

14

Novel Bumping Process for Solder on Pad Technology

Choi, Kwang-Seong, Bae, Ho-Eun, Bae, Hyun-Cheol, Eom, Yong-Sung

Journal:

Year:

2013

Language:

english

File:

PDF, 847 KB

english, 2013

15

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Optimized TSV process using bottom-up electroplating without wafer cracks

Lim, Byeong-Ok, Choi, Kwang-Seong, Eom, Yong-Sung, Bae, Hyun-Cheol, Jung, Sunghae, Sung, Ki-Jun, Moon, Jong-Tae

Year:

2010

Language:

english

File:

PDF, 1.19 MB

english, 2010

16

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - 3D SiP module using TSV and novel solder bump maker

Bae, Hyun-Cheol, Choi, Kwang-Seong, Eom, Yong-Sung, Lim, Byeong-Ok, Sung, Ki-Jun, Jung, Sunghae, Kim, Byeung-Gee, Kang, In-Soo, Moon, Jong-Tae

Year:

2010

Language:

english

File:

PDF, 1.08 MB

english, 2010

17

[IEEE 2008 International Conference on Condition Monitoring and Diagnosis, CMD 2008 - Beijing (2008.04.21-2008.04.24)] 2008 International Conference on Condition Monitoring and Diagnosis - Notice of Violation of IEEE Publication PrinciplesWireless sensor for managing electrical distribution networks

Yong-Sung Choi,, Ju-Ho Yun,, Kyung-Sup Lee,

Year:

2008

Language:

english

File:

PDF, 190 KB

english, 2008

18

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Characterization of 3D stacked high resistivity Si interposers with polymer TSV liners for 3D RF module

Choi, Kwang-Seong, Lee, Haksun, Bae, Hyun-Cheol, Eom, Yong-Sung, Lee, Kangwook, Fukushima, Takafumi, Koyanagi, Mitsumasa, Lee, Jin Ho

Year:

2015

Language:

english

File:

PDF, 1.08 MB

english, 2015

19

A Randomized Controlled Pilot Study of Cognitive Behavioral Social Skills Training (Korean version) for Middle- or Older-Aged Patients with Schizophrenia : A Pilot Study

Lee, Do-Hyeong, Ko, Seok-Man, Choi, Yong-Sung, Kim, Kun-Jong, Park, Hanson

Journal:

Journal of Korean Neuropsychiatric Association

Year:

2012

Language:

english

File:

PDF, 1.29 MB

english, 2012

20

Percentile Distributions of Birth Weight according to Gestational Ages in Korea (2010-2012)

Lee, Jin Kyoung, Jang, Hye Lim, Kang, Byung Ho, Lee, Kyung-Suk, Choi, Yong-Sung, Shim, Kye Shik, Lim, Jae Woo, Bae, Chong-Woo, Chung, Sung-Hoon

Journal:

Journal of Korean Medical Science

Year:

2016

Language:

english

File:

PDF, 4.73 MB

english, 2016

21

Direct targeting of oncogenic RAS mutants with a tumor-specific cytosol-penetrating antibody inhibits RAS mutant–driven tumor growth

Shin, Seung-Min, Kim, Ji-Sun, Park, Seong-Wook, Jun, Sei-Yong, Kweon, Hye-Jin, Choi, Dong-Ki, Lee, Dakeun, Cho, Yong Beom, Kim, Yong-Sung

Journal:

Science Advances

Year:

2020

Language:

english

File:

PDF, 1.89 MB

english, 2020

22

Development of a DNA chip microarray using hydrophobic interaction between template and particle by using the random fluidic self-assembly method

Yong-Sung Choi, Jung-Yeol Lim, Kyung-Sup Lee

Journal:

Current Applied Physics

Year:

2007

Language:

english

File:

PDF, 474 KB

english, 2007

23

Novel candidate targets of Wnt/β-catenin signaling in hepatoma cells

Heun-Sik Lee, Mee-Hee Park, Suk-Jin Yang, Kyung Chan Park, Nam-Soon Kim, Yong-Sung Kim, Dae Il Kim, Hyang-Sook Yoo, Eui-Ju Choi, Young Il Yeom

Journal:

Year:

2007

Language:

english

File:

PDF, 402 KB

english, 2007

24

Continuous-Flow Kinetic Resolution of (±)-cis-1-Amino-2-indanol by Lipase-Catalyzed N-Acetylation

Kim, Yoon-Jung, Choi, Yong-Sung, Yang, Sai, Yang, Woo, Jeong, Jin-Hyun

Journal:

Year:

2015

Language:

english

File:

PDF, 988 KB

english, 2015

25

The Differential Gene Expression Profiles between Sensitive and Resistant Breast Cancer Cells to Adriamycin by cDNA Microarray

Ahn, Myung-Ju, Lee, Ki-Hwan, Ahn, Joon-Ik, Yu, Dong-Hyun, Lee, Hye-Sook, Choi, Jung-Hye, Jang, Joung Soon, Bae, Jong Min, Lee, Yong-Sung

Journal:

Cancer Research and Treatment

Year:

2004

Language:

english

File:

PDF, 481 KB

english, 2004

26

Establishment and characterization of a lung cancer cell line, SMC-L001, from a lung adenocarcinoma

Choi, So-Jung, Lee, Hyeseon, Choe, Chungyoul, Shin, Yong-Sung, Lee, Jinseon, Moon, Sung-Hwan, Kim, Jhingook

Journal:

In Vitro Cellular & Developmental Biology - Animal

Year:

2014

Language:

english

File:

PDF, 523 KB

english, 2014

27

[IEEE 2008 International Conference on Condition Monitoring and Diagnosis, CMD 2008 - Beijing (2008.04.21-2008.04.24)] 2008 International Conference on Condition Monitoring and Diagnosis - Notice of Violation of IEEE Publication PrinciplesPractical implications of multi-agent transformer condition monitoring

Yong-Sung Choi,, Ju-Ho Yun,, Kyung-Sup Lee,

Year:

2008

Language:

english

File:

PDF, 263 KB

english, 2008

28

Transparent conductive ZnInSnO–Ag–ZnInSnO multilayer films for polymer dispersed liquid-crystal based smart windows

Kim, Eun Mi, Choi, In-Seok, Oh, Jeong-Pyo, Kim, Young-Baek, Lee, Jong-Ho, Choi, Yong-Sung, Cho, Jung-Dae, Kim, Yang-Bae, Heo, Gi-Seok

Journal:

Japanese Journal of Applied Physics

Year:

2014

Language:

english

File:

PDF, 1.09 MB

english, 2014

29

In vitro and in vivo analyses of human embryonic stem cell-derived dopamine neurons

Chang-Hwan Park, Yang-Ki Minn, Ji-Yeon Lee, Dong Ho Choi, Mi-Yoon Chang, Jae-Won Shim, Ji-Yun Ko, Hyun-Chul Koh, Min Jeong Kang, Jin Sun Kang, Duck-Joo Rhie, Yong-Sung Lee, Hyeon Son, Shin Yong Moon,

Journal:

Journal of Neurochemistry

Year:

2005

Language:

english

File:

PDF, 936 KB

english, 2005

30

[IEEE The 33rd IEEE International Conference on Plasma Science, 2006. ICOPS 2006. IEEE Conference Record - Abstracts. - Traverse City, MI, USA (2006.06.4-2006.06.8)] The 33rd IEEE International Conference on Plasma Science, 2006. ICOPS 2006. IEEE Conference Record - Abstracts. - Brightness characteristics for the input frequency of an large size external electrode fluorescent lamp (EEFL)

Seong-Jin Lee,, Yong-Sung Choi,, Jong-Chan Lee,, Dae-Hee Park,

Year:

2006

Language:

english

File:

PDF, 133 KB

english, 2006

31

Nonvolatile memories of Ge nanodots self-assembled by depositing ultrasmall amount Ge on SiO[sub 2] at room temperature

Hong, Seung Hui, Kim, Min Choul, Jeong, Pil Seong, Choi, Suk-Ho, Kim, Yong-Sung, Kim, Kyung Joong

Journal:

Applied Physics Letters

Year:

2008

Language:

english

File:

PDF, 566 KB

english, 2008

32

Inhibitory effects of tilianin on the expression of inducible nitric oxide synthase in low density lipoprotein receptor deficiency mice

Nam, Ki-Hoan, Choi, Jae-Hoon, Seo, Yun-Jeong, Lee, Young-Mi, Won, Yong-Sung, Lee, Mi-Ran, Lee, Mi-Ni, Park, Jong-Gil, Kim, Young-Myeong, Kim, Hyoung-Chin, Lee, Chul-Ho, Lee, Hyeong-Kyu, Oh, Sei-Ryang,

Journal:

Experimental and Molecular Medicine

Year:

2006

Language:

english

File:

PDF, 562 KB

english, 2006

33

Endosomal acidic pH-induced conformational changes of a cytosol-penetrating antibody mediate endosomal escape

Kim, Ji-Sun, Choi, Dong-Ki, Shin, Ju-Yeon, Shin, Seung-Min, Park, Seong-Wook, Cho, Hyun-Soo, Kim, Yong-Sung

Journal:

Journal of Controlled Release

Year:

2016

Language:

english

File:

PDF, 3.35 MB

english, 2016

34

Experimental decomposition of the positive bias temperature stress-induced instability in self-aligned coplanar InGaZnO thin-film transistors and its modeling based on the multiple stretched-exponential functions

Kim, Dae Hwan, Choi, Sungju, Jang, Juntae, Kang, Hara, Kim, Dong Myong, Choi, Sung-Jin, Kim, Yong-Sung, Oh, Saeroonter, Baeck, Ju Heyuck, Bae, Jong Uk, Park, Kwon-Shik, Yoon, Soo Young, Kang, In Byeon

Journal:

Journal of the Society for Information Display

Year:

2017

Language:

english

File:

PDF, 1.59 MB

english, 2017

35

Versatile Epoxy/Phenoxy/Anhydride-Based Hybrid Adhesive Films for Deoxidization and Electrical Interconnection

Jang, Keon-Soo, Eom, Yong-Sung, Choi, Kwang-Seong, Bae, Hyun-Cheol

Journal:

Industrial & Engineering Chemistry Research

Year:

2018

Language:

english

File:

PDF, 1.26 MB

english, 2018

36

The Risk for Incident Ischemic Heart Disease According to Estimated Glomerular Filtration Rate in A Korean Population

Park, Sung Keun, Kim, Min-Ho, Ha, Eunhee, Jung, Ju Young, Oh, Chang-Mo, Choi, Joong-Myung, Kang, Hee Yong, Choi, Yong-Sung, Kim, Min Gi, Kim, Jung-Wook, Ryoo, Jae-Hong

Journal:

Journal of Atherosclerosis and Thrombosis

Year:

2019

Language:

english

File:

PDF, 6.47 MB

english, 2019

37

Rotation of electrically charged polymer particles for potential applications to micro-propulsion systems

Do, Taegu, Chun, Youngsang, Jung, Youngkyun, Choi, Ung Su, Park, Yong-Sung, Ko, Young Gun

Journal:

Journal of Materials Chemistry C

Year:

2020

File:

PDF, 2.63 MB

2020

38

Thermal, tensile and morphological properties of gamma-ray irradiated epoxy-clay nanocomposites toughened with a liquid rubber

Kyoung-Yong Lee, Ki-Yup Kim, In-Ra Hwang, Yong-Sung Choi, Chang-Hee Hong

Journal:

Polymer Testing

Year:

2010

Language:

english

File:

PDF, 1.53 MB

english, 2010

39

[IEEE 2008 International Conference on Condition Monitoring and Diagnosis, CMD 2008 - Beijing (2008.04.21-2008.04.24)] 2008 International Conference on Condition Monitoring and Diagnosis - Notice of Violation of IEEE Publication PrinciplesAutomatic vacuum capacitor switch with modified digital filter

Yong-Sung Choi,, Ju-Ho Yun,, Kyung-Sup Lee,

Year:

2008

Language:

english

File:

PDF, 222 KB

english, 2008

40

[IEEE The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. - Seoul, Korea (June 5-9, 2005)] The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. - Hydrophobic patterned template for DNA chip microarray

Yong-Sung Choi,, Kyung-Sup Lee,, Dae-Hee Park,

Year:

2005

Language:

english

File:

PDF, 609 KB

english, 2005

41

[IEEE 5th International Conference on Properties and Applications of Dielectric Materials - Seoul, South Korea (25-30 May 1997)] Proceedings of 5th International Conference on Properties and Applications of Dielectric Materials - Study on electrical properties for detection of organic gases by using stearic acid LB films

Do-Kyun Kim,, Yong-Sung Choi,, Jeong-Soo Chang,, Young-Soo Kwon,

Year:

1997

Language:

english

File:

PDF, 293 KB

english, 1997

42

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Novel solder-on-pad (SoP) technology for fine-pitch flip chip bonding

Choi, Kwang-Seong, Sun-Woo Choo,, Jong-Jin Lee,, Ki-Jun Sung,, Hyun-Chel Bae,, Byeong-Ok Lim,, Jong-Tae Moon,, Eom, Yong-Sung

Year:

2010

Language:

english

File:

PDF, 796 KB

english, 2010

43

Erratum: Changes in the neonatal and infant mortality rate and the causes of death in Korea

Chung, Sung-Hoon, Choi, Yong-Sung, Bae, Chong-Woo

Journal:

Korean Journal of Pediatrics

Year:

2014

Language:

english

File:

PDF, 828 KB

english, 2014

44

Expression of CXCL4 and aquaporin 3 and 10 mRNAs in patients with otitis media with effusion

Jin, Zhe, Cha, Sung Ho, Choi, Yong-Sung, Kim, Young Il, Choi, Sun A., Yeo, Seung Geun

Journal:

International Journal of Pediatric Otorhinolaryngology

Year:

2016

Language:

english

File:

PDF, 276 KB

english, 2016

45

[IEEE 2006 IEEE Nanotechnology Materials and Devices Conference - Gyeongju, South Korea (2006.10.22-2006.10.25)] 2006 IEEE Nanotechnology Materials and Devices Conference - Electrical property of organic thin films

Yong-Sung Choi,, Young-Soo Kwon,, Kyung-Sup Lee,

Year:

2006

Language:

english

File:

PDF, 290 KB

english, 2006

46

[IEEE 2006 IEEE Nanotechnology Materials and Devices Conference - Gyeongju, South Korea (2006.10.22-2006.10.25)] 2006 IEEE Nanotechnology Materials and Devices Conference - Displacement properties of nanodendrimer

Yong-Sung Choi,, Young-Soo Kwon,, Kyung-Sup Lee,

Year:

2006

Language:

english

File:

PDF, 341 KB

english, 2006

47

Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life

Eom, Yong-Sung, Son, Ji-Hye, Jang, Keon-Soo, Lee, Hak-Sun, Bae, Hyun-Cheol, Choi, Kwang-Seong, Choi, Heung-Soap

Journal:

Year:

2014

Language:

english

File:

PDF, 476 KB

english, 2014

48

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology

Choi, Kwang-Seong, Eom, Yong-Sung, Moon, Seok Hwan, Joo, Jiho, Jeong, leeseul, Lee, Kwangjoo, Kim, Jung Hak, Kim, Ju hyeon, Yoon, Gil-Sang, Lee, Kwang-Hee, Lee, Chul-Hee, Ahn, Geun-Sik, Shim, Moo-Sup

Year:

2019

Language:

english

File:

PDF, 859 KB

english, 2019

49

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology

Choi, Kwang-Seong, Eom, Yong-Sung, Moon, Seok Hwan, Joo, Jiho, Jeong, leeseul, Lee, Kwangjoo, Kim, Jung Hak, Kim, Ju hyeon, Yoon, Gil-Sang, Lee, Kwang-Hee, Lee, Chul-Hee, Ahn, Geun-Sik, Shim, Moo-Sup

Year:

2019

File:

PDF, 859 KB

2019

50

[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate

EOM, Yong-Sung, JANG, Ki-Seok, JOO, Jiho, CHOI, Kwang-Seong

Year:

2019

Language:

english

File:

PDF, 3.00 MB

english, 2019

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